Stress Engineering Services uses Digital Image Correlation (DIC) to monitor and measure three-dimensional full-field deformations and strains. This non-contact optical technique can measure displacements and strains on almost any material with high accuracy. Our DIC system can be used to supplement or replace large numbers of strain gauges and other measurement devices used in full-scale testing programs.
DIC is particularly valuable for:
- Measuring surface contours, deformations, and strains on material surfaces with complex geometries
- Use in conjunction with our test labs with full scale and sub-scale testing capabilities to provide full-field strain and displacement data. Lab and field testing capabilities.
- Extreme strain applications
- High strain and displacement accuracies
- Customized solutions for a wide array of applications
- Comparing full-scale test results to FEA models
How DIC Works
Digital Image Correlation is a photogrammetry technique where two cameras are used stereoscopically to capture images of a test article (Figure 1). Advanced software then tracks surface movement of the part. The two cameras are used together to determine the three dimensional coordinates using stereo-triangulation.